Tokuyama EE-Bond - Intro Kit

In stock

SKU

IND-7088

₹6,499.00

Outstanding adhesion performance Dependable marginal integrity Reduced post-operative sensitivity Perfect cavity sealing

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TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

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